Transformation: Q&A with ChipMOS chairman and CEO SJ Cheng
ChipMOS Technologies is among very few firms that have transformed themselves successfully and are no longer influenced by the volatile memory market. Once known as a packaging and testing firm specializing in memory chips, ChipMOS has diversified its offerings to include backend services for LCD driver ICs, mixed-signal chips and niche-market logic semiconductors.
Back in 2009 when demand for PCs and other consumer devices was hit hard by the global financial crisis, the memory industry bore the brunt of the downturn. Two of ChipMOS' major clients, Spansion and ProMOS Technologies, fell into financial difficulty and were unable to repay the amounts owed to their suppliers for products or services purchased from them. ChipMOS was among the affected companies, and its combined uncollected accounts from the two customers reached about NT$2.5 billion.
Meanwhile, ChipMOS' own operation also suffered a substantial decline in customer orders during 2009, with monthly sales falling significantly. Monthly revenues at ChipMOS during 2009 were about 40% of the ordinary levels reached previously.
During its toughest time, ChipMOS had total liabilities of as high as NT$22.51 billion. The price of ChipMOS' stock listed on the NASDAQ fell to as low as US$0.18 from the previous US$5-6.
However, ChipMOS started to improve its operations in the second half of 2009 by cutting costs and adjusting its product mix, company chairman and CEO SJ Cheng noted in a recent interview with Digitimes. ChipMOS had also been seeking the best solution for its uncollected accounts receivable, and eventually managed to collect about NT$3.2 billion by selling the debts, Cheng said.
ChipMOS' consolidated revenues soared more than 40% with profits jumping almost 300% in 2010. And as of the end of 2012, the company achieved positive free and operating cash flow. It has since maintained an adequate level of cash.
The following is the interview during which Cheng discussed the company's diversification and business opportunities in the mobile device sector, and his outlook for the company.
Q: Earlier in 2013, ChipMOS started trading on the Emerging Stock Board (ESB) of the Taiwan Stock Exchange (TSE). The company also plans to submit an application by the end of the year to list its stock on the main board of the TSE. Can you tell us why you made the decision?
A: ChipMOS had been looking for the best time to debut on the TSE. We decided to do it this year in response to the advance from many of our US shareholders, while taking into consideration the rationality of stock market prices and tax savings, and ways to simplify our ownership structure.
We are aware that Asia is a global production center, where industry analysts gather. In addition, ChipMOS' partners are mostly located in Asia to support its current business focus.
ChipMOS along with subsidiaries ChipMOS Taiwan and Thailin Semiconductor are looking to start trading on the main board of the TSE during the second quarter of 2014.
Q: Can you share with us the company's diversification strategy, and intention to turn your focus away from the memory market?
A: In order to reduce its dependence on the memory sector, ChipMOS has diversified its offerings and put increased focus on fast-growth and high-margin product lines. The entry into the LCD driver IC market marked our first move to diversify away from memory products.
The number of backend houses specializing in LCD driver ICs has been reduced signficantly over the past few years. Companies intend to have a second-source alternative to Chipbond Technology, which has long been a main supplier in the sector, and ChipMOS is benefiting from the trend despite its late entry.
ChipMOS has also tapped the market for niche-market logic and mix-signal ICs, including e-compass sensors, power management ICs, timing control ICs and fingerprint sensors. In recent years, we have developed wafer-level and flip-chip packaging technologies for these applications.
We believe that the growing market for portable electronics devices will continue to spur demand for LCD driver ICs, MEMS sensors and other key components, which ChipMOS' extended backend services already cover.
ChipMOS has well improved its product mix. In the first half of 2013, sales generated from the LCD driver IC sector accounted for 40-45% of company revenues, followed by those from DRAM products with 30%, NAND flash with 20% and others about 7%.
Q: As a driver IC backend house, what is ChipMOS' outlook for the global LCD driver IC market?
A: The outlook for small- and medium-size LCD driver ICs is promising thanks to the fast-growing smartphone and tablet markets. Along with rising demand for high-resolution panels, related LCD driver IC firms are expected to see their businesses boom.
The popularity of Ultra HD TV sets is key to growth in the large-size panel driver IC sector, as Ultra HD TV panels require higher display resolution than HD TV ones. The number of driver ICs for use in Ultra HD TV panels is 200-400% more than that for use in HD TV panels.
Q: ChipMOS' deployment in the logic IC sector has born fruit by grabbing orders for e-compass sensors from Japan-based AKM. Can you tell us about the achievement?
A: ChipMOS' plans to enter the logic IC sector are to focus specifically on niche-market segments in order to avoid competiton from Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), which dominate the mass-market logic IC backend market. However, the company adopts a cautious approach to purchase new equipment for logic IC packaging and testing.
In 2012, ChipMOS signed a contract manufacturing agreement with AKM, which was looking for a second production base. Under the agreement, AKM would consign to our subsidairy Thailin certain sets of its depreciated equipment and in return, Thailin would utilize the consigned equipment as dedicated capacity to provide semiconductor testing services to the customer. Though sales generated from the orders are low, the profits made from the contract are higher than ChipMOS' average profit level due to the elimination of equipment expenses.
ChipMOS expects sales generated from the logic IC sector to account for 15-20% of company revenues by the end of 2015, from the current 7-8%.
In addition, ChipMOS has been developing new packaging technologies to extend its services for logic products. In addition to wafer-level and FC packaging, ChipMOS has its thick-plated copper process ready and started using the technology for power management chips.
ChipMOS is also eyeing the market for fingerprint sensors for use in smartphones. The company has been approached by some international vendors regarding backend services for fingerprint sensors. ChipMOS is currently working with a US-based fingerprint IC company that uses capacitive touch technology for its products.
ChipMOS is looking to develop its offerings for fingerprint sensors for two reasons. One reason is that fingerprint sensors will play a major role in future consumer electronics products, and therefore the market outlook is optimistic; the other is that ChipMOS' existing 8- and 12-inch bumping and COF packaging capacity is ideal for touch-capacitive fingerprint sensors.
Q: How about the company's outlook for the memory market?
A: Micron Technology's acquisition of Elpida Memory has helped the industry supply and demand return to a healthier status, and chip prices rebound. Such favorable market condition has also eased the pressure on backend quotes.
ChipMOS has secured packaging orders from Micron, and provides testing services for Winbond Electronics, Elite Semiconductor Memory Technology (ESMT) and Macronix International. Currently we have no plans to build additional capacity and invest in new equipment, except for NAND flash and eMCP devices.
Q: Does the company have plans to expand capacity for other product lines?
A: ChipMOS' production lines for LCD driver ICs are running tight, which encourages the company to continue building new capacity for 12-inch bumping and high-end testing in the next few years.
The efforts to expand 12-inch bumping capacity are to satisfy growing demand from our LCD driver IC customers, which have now preferred 12-inch fabs to produce their high-resolution products.
Nevertheless, ChipMOS remains cautious about capex over the next couple of years. ChipMOS' annual capex will stay at an amount equivalent to about 15% of company revenues in 2014-2015.


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