05-16-2017, 01:24 AM
A custom time-of-flight ranging sensor from STMicroelectronics NV (Geneva, Switzerland) is present in Apple's iPhone7 Plus, according to a tear-down report from System Plus Consulting. And this could lead to a significant camera improvement in the next Apple iPhone, according to the consultancy. ST's presence in the iPhone7 is fuelling speculation that similar time-of-flight (ToF) sensors are designed into the Apple iPhone7S and iPhone8 which are expected to launch in September and October of 2017, and helping to drive business optimism at ST for the second half of 2017 ( ST raises capex for "major product ramp" ). As is normal with suppliers to Apple, ST is not commenting except to say that demand for a number of products has driven its increased capex in 2017 and strong revenue expectations for the second half of 2017. Such ToF sensors can be used for auto-ranging for cameras as well as 3D imaging, proximity sensing, ambient light sensing and gesture recognition. And ToF also has application in Lidar.
iPhone7 Plus teardown hints at possible Apple 3D camera | Smart2.0
Specifically today, iGeneration is reporting that STMicroelectronics will be making sensors for the front 3D camera system, expected to be a major feature for the OLED iPhone. The 3D camera will apparently be able to detect depth of objects held in front of the iPhone and may play a big role in rumored iPhone 8 facial recognition features. The report says STMicroelectronics is now committed to providing such components for the next iPhone; in its financial report it alluded to major investment in new products without mentioning Apple by name. The CEO said it expects “a contract recently taken [will lead to] substantial revenues expected in the second half of 2017.”
Report: 3D sensor production ramp suggests iPhone 8 to launch later than September | 9to5Mac